Capabilities

/Capabilities
Capabilities 2017-10-24T07:08:22+00:00
Electronic partsElectronic parts

Min. board size: 50mm * 50mm

Max. board size: 1,200mm * 370mm

PCB thickness: 0.3mm - 4.0mm

Placement accuracy: ±0.035mm(Cpk≥1)

Placement speed: 42,000CPH

Min. component size: 0201mm

Max. square part size: 74mm * 74mm

Max. rectangular part size: 50mm * 150mm

Max. component height: 25mm

Feeder inputs: max. 112

Rigid PCB Manufacturing Capacity
Item Typical Advanced
Basic Layer Count 1L – 32L 1L – 32L
Base Material & Matching Prepreg FR-4(standard/medium/high Tg,
different CTI, halogen free, CAF resistant)
FR-4(standard/medium/high Tg,
different CTI, halogen free, CAF resistant)
PTFE PTFE
Hydrocarbon/Ceramics Hydrocarbon/Ceramics
Finished Brd. Thk. 0.30 mm – 5.00 mm 0.20 mm – 7.00 mm
Finished Copper Wt. 0.5 oz – 4.0 oz(external),
0.25 oz – 4.00 oz(internal)
0.5 oz – 8.0 oz(external),
0.25 oz – 9.00 oz(internal)
Min. Brd. Size 10.00 mm * 20.00 mm
(in-board tooling holes)
8.00 mm * 8.00 mm
Max. Brd. Size 23″ * 30″(2L), 22″ * 28″(≥4L) 23″ * 30″(2L), 22.5″ * 30″(≥4L)
Surface Finish RoHS Compliant H.A.L. Lead-free, Galvanic Gold, ENIG,
Immersion Tin, Immersion Silver, OSP, ENEPIG
H.A.L. Lead-free, Galvanic Gold, ENIG,
Immersion Tin, Immersion Silver, OSP, ENEPIG
Non-RoHS Compliant H.A.L. Leaded H.A.L. Leaded
Finish Coating Thk. Aspect Ratio for H.A.L ≤5:1(plated hole dia. ≥ 0.30 mm) ≤5:1(plated hole dia. ≥ 0.30 mm)
H.A.L.(leaded & lead-free) 1 um – 40 um 1 um – 40 um
OSP 0.2 um – 0.4 um 0.2 um – 0.4 um
ENIG 3 um – 5 um(nickle),
1 uin – 4 uin(gold)
3 um – 5 um(nickle),
1 uin – 4 uin(gold)
ENEPIG ≥ 5 um(nickle),
1 uin – 6 uin(palladium),
1 uin – 6 uin(gold)
≥ 5 um(nickle),
1 uin – 6 uin(palladium),
1 uin – 6 uin(gold)
Immerison Silver 6 uin – 12 uin 6 uin – 12 uin
Immersion Tin ≥ 1 um ≥ 1 um
Galvanic Hard Gold 5 uin – 40 uin 5 uin – 80 uin
Gold Finger/Connector 1 uin – 40 uin 1 uin – 80 uin
Blue Mask Thk. 0.20 mm – 0.60 mm 0.20 mm – 0.60 mm
Carbon Ink Thk. 10 um – 50 um 10 um – 50 um
Drill/Hole Aspect Ratio for Mechanical Drill 16:1(dia. ≥ 0.30 mm) 16:1(dia. ≥ 0.30 mm)
Min. Mechanical Drill 0.20 mm 0.10 mm
Max. Mechanical Drill 6.30 mm 6.30 mm
Mechanical Blind Drill 0.20 mm – 0.50 mm 0.20 mm – 0.70 mm
Min. Laser Drill 0.10 mm(single PP1080 thk.) 0.10 mm(single PP1080 thk.)
Max. Laser Drill 0.15 mm(single PP3313 thk.) 0.15 mm(single PP3313 thk.)
Min. Drill for Material PTFE/PTFE Composite 0.30 mm 0.30 mm
Min. Half Hole Drill 0.50 mm 0.50 mm
Min. Overlapped Drill 0.45 mm 0.45 mm
Min. Backdrill 0.50 mm 0.50 mm
Min. Dielectric Thk. for Backdrill 0.20 mm 0.20 mm
Max. Hole for Bluemask Plugging 5.00 mm 5.00 mm
Max. Hole for Soldermask Plugging 0.65 mm 0.65 mm
Hole for Epoxy Fill 0.10 mm – 0.45 mm 0.10 mm – 0.70 mm
Counter Bore/Sink Hole Angle 130°(dia.≤3.175 mm),
165°(dia. 3.175 mm – 6.300 mm)
82°, 90°, 100°,
135°(dia. 3.175 mm – 6.300 mm)
Min. Mechanical Drill for Different Brd. Thk. 0.15 mm(brd. thk. ≤ 0.80 mm) 0.10 mm(brd. thk. ≤ 0.80 mm)
0.15 mm(brd. thk. ≤ 1.40 mm) 0.15 mm(brd. thk. ≤ 1.20 mm)
0.20 mm(brd. thk. ≤ 2.80 mm) 0.20 mm(brd. thk. ≤ 2.80 mm)
Copper Feature Min. Annular Ring for Mechanical Drill 4 mil 4 mil(partially 3.5 mil)
Min. Annular Ring for Laser Drill 4 mil 4 mil(partially 3.5 mil)
Min. BGA Pad Dia. 10 mil(excluding H.A.L) 8 mil(excluding H.A.L)
Min. BGA Pad Dia. for Leaded H.A.L. 10 mil 10 mil
Min. BGA Pad Dia. for Lead-free H.A.L. 12 mil 12 mil
Min, Pad Size for H.A.L. 7 mil * 16 mil 7 mil * 16 mil
Clearance/Distance Min. External Copper to Brd. Outline
Clearance for Not Exposing Copper After Milling
8 mil 8 mil
Min. Internal Copper to Brd. Outline
Clearance for Not Exposing Copper After Milling
8 mil 8 mil
Min. Drill to Drill(different nets)
Clearance for CAF Proof
9 mil 12 mil
(≥16 mil for mission critical application)
Min. Bluemask to Pad Clearance 14 mil 14 mil
Min. Drill(compensated) to
Conductor Clearance for 1 Buildup
5.5 mil(4L),
7 mil(6L – 8L),
8 mil(10L – 16L),
9 mil(18L – 28L),
12 mil(>28L)
5.0 mil(4L),
6 mil(6L – 8L),
7 mil(10L – 16L),
8 mil(18L – 28L),
10 mil(>28L)
Min. Distance for V-score Jump 15 mm(brd. thk. ≤ 1.60 mm) 12 mm(brd. thk. ≤ 1.60 mm)
Solder Mask Lacquer Color Green(matt/glossy),
Yellow, Black(matt/glossy),
Blue, Red, White, Orange
Green(matt/glossy),
Yellow, Black(matt/glossy),
Blue, Red, White, Orange
Min. Soldermask Web 0.10 mm 0.075 mm
Min. Soldermask to Pad Clearance 0.10 mm 0.10 mm
Min. Soldermask Track Cover 0.10 mm 0.10 mm
Soldermask Thk. on Copper 10 um – 18 um 10 um – 18 um
Soldermask Thk. at Shoulder ≥ 5 um(one-time printing) ≥ 5 um(one-time printing)
Soldermask Thk. over Hole ≥ 5 um ≥ 5 um
Legend Lacquer Color White, Yellow, Black, Orange White, Yellow, Black, Orange
Min. Stroke Width 0.17 mm 0.17 mm
Min. Height for Legibility 1.00 mm 1.00 mm
Min. Legend to Pad Clearance 4 mil 4 mil
Markings Method Etched, Soldermasked,
Silkscreened/Printed
Etched, Soldermasked,
Silkscreened/Printed
Type Text, Number, Graphics,
Bar code, QR code
Text, Number, Graphics,
Bar code, QR code
Profile Panelization V-score, Tab-routing,
Tab-routing & Perforation,
Tab-routing & V-score,
Tab-routing & V-score & Perforation
V-score, Tab-routing,
Tab-routing & Perforation,
Tab-routing & V-score,
Tab-routing & V-score & Perforation
V-score Angle 20°, 30°, 60° 20°, 30°, 60°
Brd. Thk. for Double-side V-score 0.80 mm – 3.20 mm 0.80 mm – 3.20 mm
Brd. Thk. for Single-side V-score 0.60 mm – 0.80 mm 0.60 mm – 0.80 mm
Min. Inside Corner Radius 0.40 mm 0.30 mm
Finger/Edge Connector Edge Beveling Angle 30°, 45° 30°, 45°
Edge Chamfering Corner 45° 45°
Min. Notch Width beside Edge Connector 0.20 mm 0.20 mm
Edge Beveling Depth 0.50 mm 0.50 mm
Min. Finger Top to Copper Distance 3.00 mm 2.00 mm
Min. Finger Bot. to Brd. Outline 7.00 mm 6.00 mm
Min. Finger to Finger Clearance 6 mil 5 mil
Others Brd. Thk. for Epoxy Fill 0.50 mm – 6.50 mm 0.40 mm – 6.50 mm
Min. Channel for Internal Split Plane 8 mil 8 mil
Min. Trace Width/Space for Epoxy Fill 4.0 mil / 4.0 mil 3.5 mil / 3.5 mil
Rigid PCB Manufacturing Tolerance
Item Standard Advanced
Drill/Hole Hole Position Tol. ±3 mil ±3 mil
PTH Dia. Tol. ±3 mil ±3 mil
NPTH Dia. Tol. ±2 mil ±2 mil, +2 mil – 0 mil,
0 mil – (-2) mil
Pressfit Hole Dia. Tol. ±2 mil ±2 mil
Drilled Slot Hole Tol. ±0.05(L)/0.05(W) mm(unplated),
±0.13(L)/0.10(W) mm(plated)
±0.05(L)/0.05(W) mm(unplated),
±0.13(L)/0.10(W) mm(plated)
Milled Slot Hole Tol. ±0.10(L)/0.10(W) mm(unplated),
±0.13(L)/0.13(W) mm(plated)
±0.10(L)/0.10(W) mm(unplated),
±0.13(L)/0.13(W) mm(plated)
Backdrill Depth Tol. ±4 mil ±4 mil
Counter Bore/Sink Hole Angle Tol. ±10° ±10°
Counter Bore/Sink Hole Dia. Tol. ±0.20 mm ±0.20 mm
Counter Bore/Sink Hole Depth Tol. ±0.15 mm ±0.15 mm
Profile Brd. Dimension Tol. ±0.10 mm ±0.10 mm
Inside Cutout Position Tol. ±0.10 mm ±0.10 mm
V-score Angle Tol. ±5° ±5°
V-score Web Thk. Tol. ±0.05 mm ±0.05 mm
V-scores Offset Tol. ±0.10 mm ±0.10 mm
Finger/Edge Connector Edge Beveling Angle Tol. ±5° ±5°
Edge Beveling Remaining Thk. Tol. ±5 mil ±5 mil
Others Brd. Thk. Tol. ±0.10 mm(thk.≤1.00 mm),
±10%(thk.>1.00 mm)
±0.10 mm(thk.≤2.00 mm),
±0.15(2.10≤thk.≤3.00 mm)
Brd. Warp & Twist 0.75% 0.50%
Impedance Control Tol. ±5Ω(<50Ω), ±10%(≥50Ω) ±5Ω(<50Ω), ±8%(≥50Ω)
Trace Width/Space Tol. ±1.0 mil(≤10 mil),
±1.5 mil(>10 mil)
±1.0 mil(≤10 mil),
±1.5 mil(>10 mil)
Layer to Layer Registration Tol. ≤2 mil ≤2 mil
Flexible PCB Manufacturing Capability
Item Typical Advanced
Basic Layer Count 1L – 4L 1L – 8L
Base Material PI(polyimide) PI(polyimide), PET, LCP
Coverlay Color Yellow, Black, White Yellow, Black, White
Min. Brd. Size 10 mm * 20 mm 5 mm * 10 mm
Max. Brd. Size 220 mm * 380 mm 220 mm * 380 mm
Internal Copper Wt. 0.5 oz – 2.0 oz 0.5 oz – 4.0 oz
External Copper Wt. 0.5 oz – 2.0 oz 0.5 oz – 4.0 oz
Min. Single-sided Brd. Thk. 0.10 mm ± 0.05 mm 0.10 mm ± 0.05 mm
Min. Double-sided Brd. Thk. 0.20 mm ± 0.05 mm 0.20 mm ± 0.05 mm
Min. Requirement Min. Drill 0.20 mm 0.15 mm
Min. Conductor Width/Space 0.10 mm / 0.10 mm 0.10 mm / 0.10 mm
Min. Annular Ring 6 mil 4 mil
Min. Coverlay Bridge 0.20 mm 0.20 mm
Min. Copper to Brd. Edge 7 mil 7 mil
Surface Finish RoHS Compliant ENIG, Immersion Tin, Immersion Silver, OSP, ENEPIG ENIG, Immersion Tin, Immersion Silver, OSP, ENEPIG
Stiffener Material PI, FR-4 PI, FR-4, Metal
PI Stiffener Thk. 0.050 mm – 0.225 mm 0.050 mm – 0.225 mm
FR-4 Stiffener Thk. 0.30 mm – 3.20 mm 0.30 mm – 3.20 mm
Stiffener Registration 0.25 mm 0.25 mm
Tolerance Brd. Thk. Tol. ±0.05 mm(flex), ±0.10 mm(flex + stiffener) ±0.05 mm(flex), ±0.10 mm(flex + stiffener)
Brd. Dimension Tol. ±0.10 mm ±0.05 mm
Impedance Control Tol. ±10% ±10%
Soldernask Registration Tol. 0.125 mm 0.100 mm
Others Impedance Control 50Ω ± 5Ω, 100Ω ± 10% 50Ω ± 5Ω, 100Ω ± 10%
EMI Shielding Coverlay Black Black