Case Study

/Case Study
Case Study 2017-10-20T15:18:05+00:00
case01

Tg-170 FR4 material

6L board with 3 oz copper weight

ENIG for surface finish

2-side SMD assembly

Lead-free soldering workflow

Used for power management

case02

Wireless data receiver board with antenna

2.0 mm thickness of bare PCB

4-layer 35 um of copper thickness

FR4 with Tg value of 170

H.A.L lead-free for surface finish

SMT & THT lead-free assembly

case03

2.4 mm thick backplane

2 oz finished copper weight

FR4 with CTI > 200

Min. 8 / 8 mil trace width / space

Min. average 25 um of hole wall Cu thickness

RoHS compliant soldering

Application of industrial control